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Shock and Vibration
Volume 2016, Article ID 2413578, 9 pages
Research Article

System-Level Coupled Modeling of Piezoelectric Vibration Energy Harvesting Systems by Joint Finite Element and Circuit Analysis

1Science and Technology on Integrated Logistics Support Laboratory, National University of Defense Technology, Changsha 410073, China
2Faculty of Engineering and the Environment, University of Southampton, Boldrewood Campus, Southampton SO16 7QF, UK

Received 10 December 2015; Revised 27 January 2016; Accepted 3 February 2016

Academic Editor: Lorenzo Dozio

Copyright © 2016 Congcong Cheng et al. This is an open access article distributed under the Creative Commons Attribution License, which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.


A practical piezoelectric vibration energy harvesting (PVEH) system is usually composed of two coupled parts: a harvesting structure and an interface circuit. Thus, it is much necessary to build system-level coupled models for analyzing PVEH systems, so that the whole PVEH system can be optimized to obtain a high overall efficiency. In this paper, two classes of coupled models are proposed by joint finite element and circuit analysis. The first one is to integrate the equivalent circuit model of the harvesting structure with the interface circuit and the second one is to integrate the equivalent electrical impedance of the interface circuit into the finite element model of the harvesting structure. Then equivalent circuit model parameters of the harvesting structure are estimated by finite element analysis and the equivalent electrical impedance of the interface circuit is derived by circuit analysis. In the end, simulations are done to validate and compare the proposed two classes of system-level coupled models. The results demonstrate that harvested powers from the two classes of coupled models approximate to theoretic values. Thus, the proposed coupled models can be used for system-level optimizations in engineering applications.