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Shock and Vibration
Volume 2018 (2018), Article ID 4067062, 6 pages
Research Article

3D Energy Absorption Diagram Construction of Paper Honeycomb Sandwich Panel

1School of Media and Communication, Shenzhen Polytechnic, Shenzhen 518055, China
2School of Mechanical and Electrical Engineering, Shenzhen Polytechnic, Shenzhen 518055, China

Correspondence should be addressed to Dongmei Wang

Received 12 September 2017; Revised 5 January 2018; Accepted 10 January 2018; Published 7 March 2018

Academic Editor: Francesco Franco

Copyright © 2018 Dongmei Wang et al. This is an open access article distributed under the Creative Commons Attribution License, which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.


Paper honeycomb sandwich panel is an environment-sensitive material. Its cushioning property is closely related to its structural factors, the temperature and humidity, random shocks, and vibration events in the logistics environment. In order to visually characterize the cushioning property of paper honeycomb sandwich panel in different logistics conditions, the energy absorption equation of per unit volume of paper honeycomb sandwich panel was constructed by piecewise function. The three-dimensional (3D) energy absorption diagram of paper honeycomb sandwich panel was constructed by connecting the inflexion of energy absorption curve. It takes into account the temperature, humidity, strain rate, and characteristics of the honeycomb structure. On the one hand, this diagram breaks through the limitation of the static compression curve of paper honeycomb sandwich panel, which depends on the test specimen and is applicable only to the standard condition. On the other hand, it breaks through the limitation of the conventional 2D energy absorption diagram which has less information. Elastic modulus was used to normalize the plateau stress and energy absorption per unit volume. This makes the 3D energy absorption diagram universal for different material sandwich panels. It provides a new theoretical basis for packaging optimized design.