Texture, Stress, and Microstructure

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Texture, Stress, and Microstructure / 1993 / Article

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Special Issue

Proceedings of the Symposium Microscale Textures of Materials

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Volume 20 |Article ID 536014 | 12 pages | https://doi.org/10.1155/TSM.20.29

EBSP, Progress in Technique and Applications

J. Hjelen,1 R. Ørsund,2 E. Hoel,2 P. Runde,3 T. Furu,3 and E. Nes4

1Royal Norwegian Air Force Academy, Trondheim mil N-7004, Norway

2Hydro Aluminium A/S, SunndalsØra N-6601, Norway

3SINTEF, Division of Metallurgy, Trondheim N-7034, Norway

4The Norwegian Institute of Technology, Department of Metallurgy, Trondheim N-7034, Norway

Abstract

To measure grain orientation in SEM with high accuracy a new EBSP calibration software is developed. Grain orientation determination is simply based on marking three zone axes in the live EBSP. The EBSP-technique has been applied to study misorientation between subgrains in high purity and commercially pure aluminium. The lattice curvatures, which develop during deformation, increase with the amount of deformation. During annealing the subgrains grow, resulting in an increased average neighbouring misorientation due to misorientation accumulation.

Copyright © 1993 Hindawi Publishing Corporation. This is an open access article distributed under the Creative Commons Attribution License, which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.

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