Sputtered Pd as Hydrogen Storage for a Chip-Integrated Microenergy System

<table class="table-group" id="tab1"><tr><td><table class="table"><tr><td class="thead-hr" colspan="5"><hr/></td></tr><tr class="thead"><td align="left">Target material</td><td align="center">DC power (W)</td><td align="center">Ar flow (sccm)</td><td align="center">Pressure (mbar)</td><td align="center">Target bias (V)</td></tr><tr><td class="thead-hr" colspan="5"><hr/></td></tr><tr><td align="left">Ti*</td><td align="center">250</td><td align="center">55</td><td align="center"><span style="width: 49.349998px;"><svg height="16.049999" id="M14" style="vertical-align:-0.1638pt" version="1.1" viewbox="0 0 49.349998 16.049999" width="49.349998" xmlns="http://www.w3.org/2000/svg" xmlns:xlink="http://www.w3.org/1999/xlink">
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</svg></span></td><td align="center">225</td></tr><tr><td align="left">Pd</td><td align="center">100</td><td align="center">55</td><td align="center"><span style="width: 107.85px;"><svg height="16.049999" id="M15" style="vertical-align:-0.1638pt" version="1.1" viewbox="0 0 107.85 16.049999" width="107.85" xmlns="http://www.w3.org/2000/svg" xmlns:xlink="http://www.w3.org/1999/xlink">
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</svg></span></td><td align="center">337</td></tr><tr class="table-tr"><td colspan="5"><hr class="tbody-hr"/></td></tr></table></td></tr><tr class="table-fn"><td><svg height="13.75" id="M16" style="vertical-align:-0.0pt" version="1.1" viewbox="0 0 7.7375002 13.75" width="7.7375002" xmlns="http://www.w3.org/2000/svg" xmlns:xlink="http://www.w3.org/1999/xlink">
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</svg>Adhesion sublayer.<br/></td></tr></table>

Sputter parameters for the investigated Pd layers. 

The Scientific World Journal

tab1

Table 1

Table 1: Sputtered Pd as Hydrogen Storage for a Chip-Integrated Microenergy System 