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The Scientific World Journal
Volume 2014, Article ID 482363, 13 pages
http://dx.doi.org/10.1155/2014/482363
Research Article

Effects of Solder Temperature on Pin Through-Hole during Wave Soldering: Thermal-Fluid Structure Interaction Analysis

School of Mechanical Engineering, Universiti Sains Malaysia, 14300 Nibong Tebal, Penang, Malaysia

Received 21 February 2014; Accepted 28 June 2014; Published 13 August 2014

Academic Editor: Andras Szekrenyes

Copyright © 2014 M. S. Abdul Aziz et al. This is an open access article distributed under the Creative Commons Attribution License, which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.

Citations to this Article [4 citations]

The following is the list of published articles that have cited the current article.

  • Kar Lin Chia, Ban Leong Choo, Sooi Jin Lee, Cynthia Tan Sok Luang, Ming Siew Tan, and Thomas Truman, “Robotic soldering of lead free alloys,” 2018 Pan Pacific Microelectronics Symposium (Pan Pacific), pp. 1–10, . View at Publisher · View at Google Scholar
  • M.S. Abdul Aziz, M.Z. Abdullah, C.Y. Khor, and I.A. Azid, “Optimization of pin through hole connector in thermal fluid–structure interaction analysis of wave soldering process using response surface methodology,” Simulation Modelling Practice and Theory, 2015. View at Publisher · View at Google Scholar
  • Ken Imanishi, Katsuyuki Tsuji, Hajime Nomura, Mitsuo Ebisawa, and Shinichi Enoki, “Melting / solidification analysis of the PB free-solder in sleeve soldering,” ASME International Mechanical Engineering Congress and Exposition, Proceedings (IMECE), vol. 2, 2015. View at Publisher · View at Google Scholar
  • Liang Zhang, and Xin Li, “Thermal-fluid-structure interaction analysis of bladed disk system based on Kriging model and hypothetic elastomer method,” International Journal of Manufacturing Research, vol. 12, no. 2, pp. 253–269, 2017. View at Publisher · View at Google Scholar