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The Scientific World Journal
Volume 2014, Article ID 482363, 13 pages
http://dx.doi.org/10.1155/2014/482363
Research Article

Effects of Solder Temperature on Pin Through-Hole during Wave Soldering: Thermal-Fluid Structure Interaction Analysis

School of Mechanical Engineering, Universiti Sains Malaysia, 14300 Nibong Tebal, Penang, Malaysia

Received 21 February 2014; Accepted 28 June 2014; Published 13 August 2014

Academic Editor: Andras Szekrenyes

Copyright © 2014 M. S. Abdul Aziz et al. This is an open access article distributed under the Creative Commons Attribution License, which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.

How to Cite this Article

M. S. Abdul Aziz, M. Z. Abdullah, and C. Y. Khor, “Effects of Solder Temperature on Pin Through-Hole during Wave Soldering: Thermal-Fluid Structure Interaction Analysis,” The Scientific World Journal, vol. 2014, Article ID 482363, 13 pages, 2014. https://doi.org/10.1155/2014/482363.