Effects of Solder Temperature on Pin Through-Hole during Wave Soldering: Thermal-Fluid Structure Interaction Analysis

<table class="table-group" width="800px"><tr class="fig-image" id="a"><td><img alt="482363.fig.006a" src="https://static.hindawi.com/articles/tswj/volume-2014/482363/figures/482363.fig.006a.jpg"/></td></tr><tr class="fig-caption"><td align="center"><table><tr><td><b>(a) </b>Actual experimental setup</td></tr></table></td></tr><tr class="fig-image" id="b"><td><img alt="482363.fig.006b" src="https://static.hindawi.com/articles/tswj/volume-2014/482363/figures/482363.fig.006b.jpg"/></td></tr><tr class="fig-caption"><td align="center"><table><tr><td><b>(b) </b>Schematic illustration of experimental setup</td></tr></table></td></tr></table>

<table>Experimental setup of wave soldering process.</table>

The Scientific World Journal

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Figure 6

Figure 6: Effects of Solder Temperature on Pin Through-Hole during Wave Soldering: Thermal-Fluid Structure Interaction Analysis 