Effect of Titanium Addition on the Thermal Properties of Diamond/Cu-Ti Composites Fabricated by Pressureless Liquid-Phase Sintering Technique

Table 2

The calculation values of the interfacial resistance and theoretical thermal conductivity of the 50 vol% diamond/Cu-0.6 at % Ti composite.

𝑅TiC/diamond; (m^2·K/W)	𝑅TiC; (m^2·K/W)	𝑅Cu/TiC(m^2·K/W)	𝑅𝑘; (m^2·K/W)	𝐾^eff𝑝(W/m·K)	𝐾𝑐; (W/m·K)	𝐾𝑐-𝑝; (W/m·K)
5.2 × 10^−10	1.4 × 10^−8	1.4 × 10^−10	1.5 × 10^−8	1530	761	725