Heat Removal from Bipolar Transistor by Loop Heat Pipe with Nickel and Copper Porous Structures
Figure 2
Microscopic pictures of the sintered structures from copper powders. (a) Grain size of 50 μm, sintering temperature of 800°C, and sintering time of 30 min. (b) Grain size of 100 μm, sintering temperature of 800°C, and sintering time of 30 min. (c) Grain size of 50 μm, sintering temperature of 950°C, and sintering time of 30 min. (d) Grain size of 100 μm, sintering temperature of 950°C, and sintering time of 30 min. (e) Grain size of 50 μm, sintering temperature of 950°C, and sintering time of 90 min. (f) Grain size of 100 μm, sintering temperature of 950°C, and sintering time of 90 min.
