Thermal Cycling Life Prediction of Sn-3.0Ag-0.5Cu Solder Joint Using Type-I Censored Data

<div class="floats-full-page floats-full-page-figure"><h2>Figure 2</h2><div class="floats-full-page-caption"><table>The detail package structure of the BGA (a) basic structure and (b) the details of the BGA.</table></div><div class="floats-full-page-content"><table class="table-group" width="800px"><tr class="fig-image"><td><img alt="807693.fig.002" src="https://static-01.hindawi.com/articles/tswj/volume-2014/807693/figures/807693.fig.002.jpg" /></td></tr></table></div></div>

Figure 2 | Thermal Cycling Life Prediction of Sn-3.0Ag-0.5Cu Solder Joint Using Type-I Censored Data

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Figure 2: Thermal Cycling Life Prediction of Sn-3.0Ag-0.5Cu Solder Joint Using Type-I Censored Data

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Figure 2

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