The Scientific World Journal / 2014 / Article / Fig 4

Research Article

Thermal Cycling Life Prediction of Sn-3.0Ag-0.5Cu Solder Joint Using Type-I Censored Data

Figure 4

Optical images (200x) of dye penetration and dye rate. (a) 45%, (b) 100%, (c) 50% under polarized light, (d) 100% under polarized light.
807693.fig.004a
(a)
807693.fig.004b
(b)
807693.fig.004c
(c)
807693.fig.004d
(d)