The Scientific World Journal / 2014 / Article / Fig 5

Research Article

Thermal Cycling Life Prediction of Sn-3.0Ag-0.5Cu Solder Joint Using Type-I Censored Data

Figure 5

Crack image after 2500 thermal cycles. (a) A complete solder joint and (b) a corner of BGA side.
807693.fig.005a
(a)
807693.fig.005b
(b)