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2014
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Tab 4
Research Article
Thermal Cycling Life Prediction of Sn-3.0Ag-0.5Cu Solder Joint Using Type-I Censored Data
Table 4
The results obtained by using Matlab.
Parameters
SSE
-square
RMSE
BGA
1.658 (1.087, 2.229)
2919
0.0059
0.9709
0.0385
FBGA
1.769 (1.762, 1.776)
3073
0.00096
0.9947
0.0126