Thermal Cycling Life Prediction of Sn-3.0Ag-0.5Cu Solder Joint Using Type-I Censored Data

Table 4

The results obtained by using Matlab.

Parameters	𝑚^′′	𝜂^′′	SSE	𝑅-square	RMSE
BGA	1.658 (1.087, 2.229)	2919	0.0059	0.9709	0.0385
FBGA	1.769 (1.762, 1.776)	3073	0.00096	0.9947	0.0126