The Scientific World Journal / 2014 / Article / Tab 4

Research Article

Thermal Cycling Life Prediction of Sn-3.0Ag-0.5Cu Solder Joint Using Type-I Censored Data

Table 4

The results obtained by using Matlab.

Parameters SSE -squareRMSE

BGA1.658 (1.087, 2.229)29190.00590.97090.0385
FBGA1.769 (1.762, 1.776)30730.000960.99470.0126