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VLSI Design
Volume 10 (2000), Issue 4, Pages 355-389
http://dx.doi.org/10.1155/2000/86517

Electro-thermal Modelling of Monolithic and Hybrid Microwave and Millimeter Wave IC's

1lnstitute of Microwaves and Photonics, School of Electronic and Electrical Engineering, The University of Leeds, Leeds LS2 9JT, UK
2Filtronic plc, The Waterfront, Salts Mill Road, Shipley BD18 3TT, UK

Received 16 December 1998; Accepted 14 December 1999

Copyright © 2000 Hindawi Publishing Corporation. This is an open access article distributed under the Creative Commons Attribution License, which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.

Citations to this Article [9 citations]

The following is the list of published articles that have cited the current article.

  • W. Batty, A.J. Panks, R.G. Johnson, and C.M. Snowden, “Electrothermal modeling and measurement for spatial power combining at millimeter wavelengths,” IEEE Transactions on Microwave Theory and Techniques, vol. 47, no. 12, pp. 2574–2585, 1999. View at Publisher · View at Google Scholar
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  • W. Batty, C.E. Christoffersen, A.J. Panks, S. David, C.M. Snowden, and M.B. Steer, “Electrothermal CAD of power devices and circuits with fully physical time-dependent compact thermal modeling of complex nonlinear 3-d systems,” IEEE Transactions on Components and Packaging Technologies, vol. 24, no. 4, pp. 566–590, 2001. View at Publisher · View at Google Scholar
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  • W. Batty, C.E. Christoffersen, A.B. Yakovlev, J.F. Whitaker, A. Mortazawi, A. Al-Zayed, M. Ozkar, S.C. Ortiz, R.M. Reano, K. Yang, L.P.B. Katehi, C.M. Snowden, and M.B. Steer, “Global coupled EM-electrical-thermal simulation and experimental validation for a spatial power combining MMIC array,” IEEE Transactions on Microwave Theory and Techniques, vol. 50, no. 12, pp. 2820–2833, 2002. View at Publisher · View at Google Scholar
  • C.M. Snowden, “Recent developments in compound semiconductor microwave power transistor technology,” IEE Proceedings: Circuits, Devices and Systems, vol. 151, no. 3, pp. 259–264, 2004. View at Publisher · View at Google Scholar
  • N.J. Pilgrim, W. Batty, R.W. Kelsall, and C.M. Snowden, “Nanoscale electrothermal co-simulation: compact dynamic models of hyperbolic heat transport and self-consistent device Monte Carlo,” Microelectronics Journal, vol. 35, no. 10, pp. 823–830, 2004. View at Publisher · View at Google Scholar
  • Dragica Vasileska, Katerina Raleva, and Stephen M. Goodnick, “Self-Heating Effects in Nanoscale FD SOI Devices: The Role of the Substrate, Boundary Conditions at Various Interfaces, and the Dielectric Material Type for the BOX,” IEEE Transactions on Electron Devices, vol. 56, no. 12, pp. 3064–3071, 2009. View at Publisher · View at Google Scholar
  • Yabin Zhang, and Paolo Emilio Bagnoli, “A modeling methodology for thermal analysis of the PCB structure,” Microelectronics Journal, vol. 45, no. 8, pp. 1033–1052, 2014. View at Publisher · View at Google Scholar