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Wireless Communications and Mobile Computing
Volume 2017, Article ID 6083626, 8 pages
https://doi.org/10.1155/2017/6083626
Research Article

Wireless Interconnect in Multilayer Chip-Area-Networks for Future Multimaterial High-Speed Systems Design

Micro-/Nano-Electronic System Integration R&D Centre (MESIC), University of Science and Technology of China (USTC), Hefei, Anhui 230026, China

Correspondence should be addressed to Oluwole John Famoriji; nc.ude.ctsu.liam@ijiromaf

Received 9 August 2017; Revised 2 October 2017; Accepted 16 October 2017; Published 5 December 2017

Academic Editor: Eva Antonino Daviu

Copyright © 2017 Oluwole John Famoriji et al. This is an open access article distributed under the Creative Commons Attribution License, which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.

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