Table of Contents Author Guidelines Submit a Manuscript
Advances in Materials Science and Engineering
Volume 2013 (2013), Article ID 352173, 7 pages
http://dx.doi.org/10.1155/2013/352173
Research Article

An Experimental Study on Heat Conduction and Thermal Contact Resistance for the AlN Flake

Department of Mechanical Engineering, Kun Shan University, Tainan 710, Taiwan

Received 24 August 2013; Accepted 17 October 2013

Academic Editor: Teen-Hang Meen

Copyright © 2013 Huann-Ming Chou et al. This is an open access article distributed under the Creative Commons Attribution License, which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.

How to Cite this Article

Huann-Ming Chou, Jin-Chi Wang, and Yuh-Ping Chang, “An Experimental Study on Heat Conduction and Thermal Contact Resistance for the AlN Flake,” Advances in Materials Science and Engineering, vol. 2013, Article ID 352173, 7 pages, 2013. doi:10.1155/2013/352173