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Advances in Materials Science and Engineering
Volume 2013, Article ID 391267, 9 pages
http://dx.doi.org/10.1155/2013/391267
Research Article

Thermal and Cure Kinetics of Epoxy Molding Compounds Cured with Thermal Latency Accelerators

Department of Chemical and Materials Engineering, National University of Kaohsiung, No. 700, Kaohsiung University Road, Nan-Tzu District, Kaohsiung 811, Taiwan

Received 30 November 2012; Accepted 14 January 2013

Academic Editor: Roham Rafiee

Copyright © 2013 Chean-Cheng Su et al. This is an open access article distributed under the Creative Commons Attribution License, which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.

Citations to this Article [15 citations]

The following is the list of published articles that have cited the current article.

  • Chen-Sian You, Cheng-Fu Yang, Wei-Ting Tsai, Song-Mao Wu, and Chean-Cheng Su, “Preparation and characterization of epoxy/vermiculite nanocomposites,” 2016 International Conference on Advanced Materials for Science and Engineering (ICAMSE), pp. 119–120, . View at Publisher · View at Google Scholar
  • Chean-Cheng Su, Chien-Huan Wei, and Chih-Chieh Yang, “Elucidating How Advanced Organophosphine Accelerators Affect Molding Compounds,” Industrial & Engineering Chemistry Research, vol. 52, no. 7, pp. 2528–2536, 2013. View at Publisher · View at Google Scholar
  • Tarun Chand Vagvala, Shyam Sudhir Pandey, Yuhei Ogomi, and Shuzi Hayase, “Gallium(iii) xanthate as a novel thermal latent curing agent for an epoxy resin composite,” RSC Advances, vol. 4, no. 47, pp. 24658, 2014. View at Publisher · View at Google Scholar
  • Chean-Cheng Su, Chien-Huan Wei, Yin-Shuo Li, Ping-Hsun Yang, Chean-Cheng Su, Chien-Huan Wei, Yin-Shuo Li, and Ping-Hsun Yang, “High Performance Microelectronic Molding Compounds Cured with Organophosphine Accelerators,” Proceedings Of The 2Nd International Conference On Intelligent Technologies And Engineering Systems (Icites2013), vol. 293, pp. 27–32, 2014. View at Publisher · View at Google Scholar
  • Chean-Cheng Su, Cheng-Fu Yang, and Chien-Huan Wei, “Cure kinetics of high performance epoxy molding compounds,” Advanced Materials Research, vol. 1024, pp. 151–154, 2014. View at Publisher · View at Google Scholar
  • Tarun Chand Vagvala, Shyam Sudhir Pandey, Suvratha Krishnamurthy, and Shuzi Hayase, “Effect of Varying Alkyl Chain Length on Thermal Decomposition Temperature of Zinc(II) Xanthates and its Impact on Curing of Epoxy Resin,” Zeitschrift für anorganische und allgemeine Chemie, 2015. View at Publisher · View at Google Scholar
  • Cheng-Fu Yang, Li-Fen Wang, Song-Mao Wu, and Chean-Cheng Su, “Characterization and Curing Kinetics of Epoxy/Silica Nano-Hybrids,” Materials, vol. 8, no. 10, pp. 7032–7040, 2015. View at Publisher · View at Google Scholar
  • Abdolreza Mirmohseni-Namin, Saeid Nikafshar, and Farid Mirmohseni, “Increasing toughness and tensile strength of an epoxy?diamine system using an inorganic ultra-accelerator,” RSC Adv., vol. 5, no. 65, pp. 53025–53035, 2015. View at Publisher · View at Google Scholar
  • Pollawat Charoeythornkhajhornchai, Chavakorn Samthong, Kanoktip Boonkerd, and Anongnat Somwangthanaroj, “Effect of azodicarbonamide on microstructure, cure kinetics and physical properties of natural rubber foam,” Journal of Cellular Plastics, vol. 53, no. 3, pp. 287–303, 2016. View at Publisher · View at Google Scholar
  • Yao-Wen Hsu, Chia-Ching Wu, Song-Mao Wu, and Chean-Cheng Su, “Synthesis and Properties of Carbon Nanotube-Grafted Silica Nanoarchitecture-Reinforced Poly(Lactic Acid),” Materials, vol. 10, no. 7, pp. 829, 2017. View at Publisher · View at Google Scholar
  • Da Eun Lee, Hyun Woo Kim, Byung-Seon Kong, and Hyung Ouk Choi, “A study on the curing kinetics of epoxy molding compounds with various latent catalysts using differential scanning calorimetry,” Journal of Applied Polymer Science, pp. 45252, 2017. View at Publisher · View at Google Scholar
  • Yowching Liaw, Hsing Yuan Yen, and Jung-Hua Chou, “The Effect of Green Flame Retardants on the Properties of Encapsulation Molding Compounds,” IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 7, no. 12, pp. 1951–1956, 2017. View at Publisher · View at Google Scholar
  • Pollawat Charoeythornkhajhornchai, Chavakorn Samthong, and Anongnat Somwangthanaroj, “Influence of sulfenamide accelerators on cure kinetics and properties of natural rubber foam,” Journal of Applied Polymer Science, 2017. View at Publisher · View at Google Scholar
  • Hao Chang, Baotan Zhang, Pengli Zhu, Rong Sun, and Chingping Wong, “Preparation and characterization of the double-side adhesive tape with reactive properties and high thermal conductivity for electronic package,” Proceedings - 2018 19th International Conference on Electronic Packaging Technology, ICEPT 2018, pp. 319–323, 2018. View at Publisher · View at Google Scholar
  • Eun Lee Da, Han-Jung Cho, Byung-Seon Kong, and Hyung Ouk Choi, “Investigation on Curing Characterization of Epoxy Molding Compounds with Different Latent Catalysts by Thermal, Electrical and Mechanical Analysis,” Thermochimica Acta, 2019. View at Publisher · View at Google Scholar