Advances in Materials Science and Engineering / 2013 / Article / Fig 6

Research Article

Comparison of H2 and NH3 Treatments for Copper Interconnects

Figure 6

(a) OM image of bubble-like defects; (b) cross-section SEM images of a bubble defect.
825195.fig.006a
(a)
825195.fig.006b
(b)

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