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Advances in Materials Science and Engineering
Volume 2013, Article ID 950791, 6 pages
http://dx.doi.org/10.1155/2013/950791
Research Article

Crack Detection in Single-Crystalline Silicon Wafer Using Laser Generated Lamb Wave

1Graduate School of Mechanical Engineering, Hanyang University, Seoul 133-791, Republic of Korea
2School of Mechanical Engineering, Hanyang University, Seoul 133-791, Republic of Korea

Received 19 July 2013; Revised 16 November 2013; Accepted 18 November 2013

Academic Editor: Yan Yang

Copyright © 2013 Min-Kyoo Song and Kyung-Young Jhang. This is an open access article distributed under the Creative Commons Attribution License, which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.

Citations to this Article [8 citations]

The following is the list of published articles that have cited the current article.

  • Marco Pizzolato, Bernard Masserey, Jean-Luc Robyr, and Paul Fromme, “Guided ultrasonic wave beam skew in silicon wafers,” vol. 1949, pp. 090005, . View at Publisher · View at Google Scholar
  • Cunfu He, Yuepeng Liu, Zenghua Liu, and Bin Wu, “Air-coupled Lamb waves propagation characteristics and defect detection in monocrystalline silicon,” Jixie Gongcheng Xuebao/Journal of Mechanical Engineering, vol. 51, no. 12, pp. 1–7, 2015. View at Publisher · View at Google Scholar
  • Cunfu He, Yaoyao Wang, Yan Lu, Yuepeng Liu, and Bin Wu, “Design and Fabrication of Air-Based 1-3 Piezoelectric Composite Transducer for Air-Coupled Ultrasonic Applications,” Journal of Sensors, vol. 2016, pp. 1–11, 2016. View at Publisher · View at Google Scholar
  • Marco Pizzolato, Bernard Masserey, Jean-Luc Robyr, and Paul Fromme, “High frequency guided wave propagation in monocrystalline silicon wafers,” Proceedings of SPIE - The International Society for Optical Engineering, vol. 10170, 2017. View at Publisher · View at Google Scholar
  • Zenghua Liu, and Honglei Chen, “Application and Challenges of Signal Processing Techniques for Lamb Waves Structural Integrity Evaluation: Part A-Lamb Waves Signals Emitting and Optimization Techniques,” Structural Health Monitoring from Sensing to Processing, 2018. View at Publisher · View at Google Scholar
  • Yorinobu Murata, Misato Nishikawa, and Masataka Matsuda, “Basic Study on Microcrack Inspection for Silicon Wafer using the Nonlinearity of Lamb Wave,” IEEJ Transactions on Electronics, Information and Systems, vol. 138, no. 12, pp. 1566–1572, 2018. View at Publisher · View at Google Scholar
  • Marco Pizzolato, Jean-Luc Robyr, Bernard Masserey, and Paul Fromme, “Lamb wave propagation in monocrystalline silicon wafers,” Journal of the Acoustical Society of America, vol. 143, no. 1, pp. 287–295, 2018. View at Publisher · View at Google Scholar
  • Michael Lauper, Bernard Masserey, Paul Fromme, and Jean-Luc Robyr, “Silicon wafer defect detection using high frequency guided waves,” Proceedings of SPIE - The International Society for Optical Engineering, vol. 10600, 2018. View at Publisher · View at Google Scholar