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Advances in Materials Science and Engineering
Volume 2014, Article ID 383041, 1 page
http://dx.doi.org/10.1155/2014/383041
Editorial

Nanostructured Materials for Microelectronic Applications

1Department of Electrical Engineering, Institute of Microelectronics, National Cheng Kung University, Tainan 701, Taiwan
2Department of Electronic Engineering, National Formosa University, Yunlin 632, Taiwan
3Aeronautics, Astronautics and Computational Engineering, University of Southampton, Southampton SO17 1BJ, UK
4College of Physics and Information Engineering, Fuzhou University, Fuzhou 350116, Fujian, China
5Institute of Electro-Optical and Materials Science, National Formosa University, Yunlin 632, Taiwan

Received 29 January 2014; Accepted 29 January 2014; Published 6 March 2014

Copyright © 2014 Shoou-Jinn Chang et al. This is an open access article distributed under the Creative Commons Attribution License, which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.

How to Cite this Article

Shoou-Jinn Chang, Teen-Hang Meen, Stephen D. Prior, Artde Donald Kin-Tak Lam, and Liang-Wen Ji, “Nanostructured Materials for Microelectronic Applications,” Advances in Materials Science and Engineering, vol. 2014, Article ID 383041, 1 pages, 2014. https://doi.org/10.1155/2014/383041.