Effects of Rolling Reduction and Strength of Composed Layers on Bond Strength of Pure Copper and Aluminium Alloy Clad Sheets Fabricated by Cold Roll Bonding

<div class="floats-full-page floats-full-page-other"><h2>Table 1</h2><div class="floats-full-page-caption">The chemical composition of AA5052 and AA5083.</div><div class="floats-full-page-content"><table class="table-group" id="tab1"><tr><td><table class="table"><tr><td class="thead-hr" colspan="9"><hr /></td></tr><tr class="thead"><td align="left">Element (mass %)</td><td align="center">Si</td><td align="center">Fe</td><td align="center">Cu</td><td align="center">Mn</td><td align="center">Mg</td><td align="center">Cr</td><td align="center">Zn</td><td align="center">Al</td></tr><tr><td class="thead-hr" colspan="9"><hr /></td></tr><tr><td align="left">AA5052</td><td align="center">0.10 </td><td align="center">0.26 </td><td align="center">0.02 </td><td align="center">0.04 </td><td align="center">2.50 </td><td align="center">0.20 </td><td align="center">0.03 </td><td align="center">Bal.</td></tr><tr><td align="left">AA5083</td><td align="center">0.14 </td><td align="center">0.20 </td><td align="center">0.02 </td><td align="center">0.68 </td><td align="center">4.40 </td><td align="center">0.12 </td><td align="center">0.00 </td><td align="center">Bal.</td></tr><tr class="table-tr"><td colspan="9"><hr class="tbody-hr" /></td></tr></table></td></tr></table></div></div>

Table 1 | Effects of Rolling Reduction and Strength of Composed Layers on Bond Strength of Pure Copper and Aluminium Alloy Clad Sheets Fabricated by Cold Roll Bonding

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Table 1: Effects of Rolling Reduction and Strength of Composed Layers on Bond Strength of Pure Copper and Aluminium Alloy Clad Sheets Fabricated by Cold Roll Bonding

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Table 1

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<p><em>Advances in Materials Science and Engineering </em>publishes research in all areas of materials science and engineering, including the synthesis and properties of materials, and their applications in engineering applications.</p>


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<p>Chief Editor, Amit Bandyopadhyay, is based at Washington State University and is interested in &nbsp;the fields of additive manufacturing or 3D printing of advanced materials. His current research is focused on metal additive manufacturing, biomedical devices and multi‑materials structures.</p>


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