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Advances in Materials Science and Engineering
Volume 2014, Article ID 696893, 6 pages
http://dx.doi.org/10.1155/2014/696893
Research Article

Influence of the Molecular Adhesion Force on the Indentation Depth of a Particle into the Wafer Surface in the CMP Process

1School of Mechanical Engineering, Jiangnan University, Wuxi 214122, China
2Jiangsu Key Laboratory of Advanced Food Manufacturing Equipment & Technology, Jiangnan University, Wuxi 214122, China

Received 8 July 2014; Revised 2 November 2014; Accepted 15 November 2014; Published 25 November 2014

Academic Editor: Rui Zhang

Copyright © 2014 Zhou Jianhua et al. This is an open access article distributed under the Creative Commons Attribution License, which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.

How to Cite this Article

Zhou Jianhua, Jiang Jianzhong, and He Xueming, “Influence of the Molecular Adhesion Force on the Indentation Depth of a Particle into the Wafer Surface in the CMP Process,” Advances in Materials Science and Engineering, vol. 2014, Article ID 696893, 6 pages, 2014. https://doi.org/10.1155/2014/696893.