Influence of the Molecular Adhesion Force on the Indentation Depth of a Particle into the Wafer Surface in the CMP Process

Table 2

Parameters calculating forces between wafer and abrasive.

Parameter	Value	Reference
Young’s modulus of wafer (MPa)	130000	[5]
Poisson’s ratio of wafer	0.26	[5]
Wafer surface hardness (MPa)	5000	[7]
Young’s modulus of particle (MPa)	310000	[4]
Poisson’s ratio of particle	0.26	[4]
Particle density (kg/m^3)	3600	[4]
Young’s modulus of pad (MPa)	10	[8]
Poisson’s ratio of pad	0.5	[8]
Mass concentration of particles	0.034	[9]
Slurry density (kg/m^3)	1000	[9]
Particle diameter (nm)	200	[9]