Journals
Publish with us
Publishing partnerships
About us
Blog
Advances in Materials Science and Engineering
Journal overview
For authors
For reviewers
For editors
Table of Contents
Special Issues
Advances in Materials Science and Engineering
/
2014
/
Article
/
Fig 7
/
Research Article
Research of Joining Brittle Nonmetallic Materials with an Active Solder
Figure 7
Microstructure of Ti/100Sn solder/SiO
2
joint and the concentration profiles of Si, Sn, and Ti elements across the joint boundary.