Research Article
Effect of Liquid Phase Additions on Microstructure and Thermal Properties in Copper and Copper-Diamond Composites
Figure 4
SEM images of: (a) Cu + 10 wt.%, (b) 20 wt.% Ag72Cu powder sintered at 825°C, 45 MPa, 100°C min−1, 20 min hold time.
| (a) |
| (b) |