Effect of Liquid Phase Additions on Microstructure and Thermal Properties in Copper and Copper-Diamond Composites

<div>(a) Optical image and (b) SEM image including EDX spot analysis of Cu-10 wt.% Ag72Cu-10 vol.% diamond clearly showing the presence of liquid phase at the copper-diamond interface during sintering.</div>

Advances in Materials Science and Engineering

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Figure 7

Figure 7: Effect of Liquid Phase Additions on Microstructure and Thermal Properties in Copper and Copper-Diamond Composites 