Effect of Liquid Phase Additions on Microstructure and Thermal Properties in Copper and Copper-Diamond Composites

<div>Thermal conductivities of Cu, Cu-Ag72Cu, and Cu-Cu<sub>5</sub>Si systems with diamond additions.</div>

Advances in Materials Science and Engineering

Figure 9: Effect of Liquid Phase Additions on Microstructure and Thermal Properties in Copper and Copper-Diamond Composites 