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Advances in Materials Science and Engineering
Volume 2014, Article ID 832308, 8 pages
http://dx.doi.org/10.1155/2014/832308
Research Article

Effect of Liquid Phase Additions on Microstructure and Thermal Properties in Copper and Copper-Diamond Composites

1Applied Research Laboratory, The Pennsylvania State University, University Park, PA 168022, USA
2Momentive Performance Materials, 22557 Lunn Road, Strongsville, OH 44149, USA
3Department of Mechanical Engineering, The Pennsylvania State University, University Park, PA 16802, USA

Received 28 September 2014; Accepted 15 November 2014; Published 3 December 2014

Academic Editor: Bin Li

Copyright © 2014 A. Rape et al. This is an open access article distributed under the Creative Commons Attribution License, which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.

Linked References

  1. K. Yoshida and H. Morigami, “Thermal properties of diamond/copper composite material,” Microelectronics Reliability, vol. 44, no. 2, pp. 303–308, 2004. View at Publisher · View at Google Scholar · View at Scopus
  2. T. Schubert, L. Ciupinski, W. Zielinski et al., “Interfacial characterization of Cu/diamond composites prepared by powder metallurgy for heat sink applications,” Scripta Materials, vol. 58, pp. 263–266, 2008. View at Publisher · View at Google Scholar
  3. T. Schubert, B. Trindade, T. Weißgärber, and B. Kieback, “Interfacial design of Cu-based composites prepared by powder metallurgy for heat sink applications,” Materials Science and Engineering A, vol. 475, no. 1-2, pp. 39–44, 2008. View at Publisher · View at Google Scholar
  4. K. K. Mizuuchi, “Thermal conductivity of diamond particle dispersed aluminum matrix composites fabricated in solid-liquid co-existent state by SPS,” Composites. Part B: Engineering, vol. 42, pp. 1029–1034, 2011. View at Publisher · View at Google Scholar
  5. K. Mizuuchi, K. Inoue, Y. Agari et al., “Processing of diamond particle dispersed aluminum matrix composites in continuous solid-liquid co-existent state by SPS and their thermal properties,” Composites Part B: Engineering, vol. 42, no. 4, pp. 825–831, 2011. View at Publisher · View at Google Scholar · View at Scopus
  6. E. A. Olevsky, S. Kandukuri, and L. Froyen, “Consolidation enhancement in spark-plasma sintering: impact of high heating rates,” Journal of Applied Physics, vol. 102, no. 11, Article ID 114913, 2007. View at Publisher · View at Google Scholar · View at Scopus
  7. A. Rape, S. Chanthapan, J. Singh, and A. Kulkarni, “Engineered chemistry of Cu-W composites sintered by field-assisted sintering technology for heat sink applications,” Journal of Materials Science, vol. 46, no. 1, pp. 94–100, 2011. View at Publisher · View at Google Scholar · View at Scopus
  8. J. R. Groza and A. Zavaliangos, “Sintering activation by external electrical field,” Materials Science and Engineering A, vol. 287, no. 2, pp. 171–177, 2000. View at Publisher · View at Google Scholar · View at Scopus