Effect of Liquid Phase Additions on Microstructure and Thermal Properties in Copper and Copper-Diamond Composites

Table 1

Summary of starting powers and processing conditions.

Starting powder; (10 vol% diamond is assumed)	Sintering temperature (°C)	Heating rate (°C min^−1)	Sintering time (min)
Pure copper	825	50	20
Ag72Cu	725	50	20
	760		20
	825		Squeezed out
Copper + 10 wt.% Ag72Cu; (with and without diamond)	825	10	n/a
		100	5
			20
		400	n/a
Copper + 20 wt.% Ag72Cu	825	100	20
Copper + 10 wt.% Cu5Si + Dia	900	50	20