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Advances in Materials Science and Engineering
Volume 2015, Article ID 179714, 8 pages
Research Article

Hot Embossing of Zr-Based Bulk Metallic Glass Micropart Using Stacked Silicon Dies

1State Key Laboratory of Digital Manufacturing Equipment and Technology, Huazhong University of Science and Technology, Wuhan 430074, China
2Jiangxi Province Key Laboratory of Numerical Control Technology and Application, Jiujiang 332005, China

Received 11 February 2015; Revised 29 May 2015; Accepted 14 June 2015

Academic Editor: Jörg M. K. Wiezorek

Copyright © 2015 Zhijing Zhu et al. This is an open access article distributed under the Creative Commons Attribution License, which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.


We demonstrated hot embossing of Zr65Cu17.5Ni10Al7.5 bulk metallic glass micropart using stacked silicon dies. Finite element simulation was carried out, suggesting that it could reduce the stress below 400 MPa in the silicon dies and enhance the durability of the brittle silicon dies when using varying load mode (100 N for 60 s and then 400 N for 60 s) compared with using constant load mode (200 N for 120 s). A micropart with good appearance was fabricated under the varying load, and no silicon die failure was observed, in agreement with the simulation. The amorphous state of the micropart was confirmed by differential scanning calorimeter and X-ray diffraction, and the nanohardness and Young’s modulus were validated close to those of the as-cast BMG rods by nanoindentation tests. The results proved that it was feasible to adopt the varying load mode to fabricate three-dimensional Zr-based bulk metallic glass microparts by hot embossing process.