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Advances in Materials Science and Engineering
Volume 2015, Article ID 257231, 10 pages
Research Article

XPS Depth Study on the Liquid Oxidation of Sn-Bi-Zn-X(Al/P) Alloy and the Effect of Al/P on the Film

1School of Material and Science Engineering, Jiangsu University of Science and Technology, Zhenjiang 212003, China
2School of Mechanical and Electrical Engineering, Shanghai Dianji University, Shanghai 201306, China

Received 7 April 2015; Revised 20 June 2015; Accepted 22 June 2015

Academic Editor: Aziz Dinia

Copyright © 2015 X. J. Wang et al. This is an open access article distributed under the Creative Commons Attribution License, which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.


X-ray photoelectron spectroscopy (XPS) was used to study the properties of liquid oxidation of Sn-Bi-Zn (SBZ) solder alloys and the effect of Al/P on the oxide film. The results showed that the oxidation film on SBZ surface was in high concentration of both oxygen and zinc. Adding trace amount of Al/P to SBZ alloys (SBZA/ABZP) decreased the ratio of O/M (M could be Sn, Bi, and Al/P) and changed the film compositions. Layers near the free surface of oxidation film mostly contained Zn2+ and Al3+ oxides for SBZA. From the half quantitative analysis result, the aluminum had a surface enrichment behavior in liquid solder, so did phosphorus and zinc. Therefore, the Al/P addition changed their stoichiometry such as the ratio of O/M near film surface.