Research Article
Dynamic Fracture Toughness of TaC/CNTs/SiC CMCs Prepared by Spark Plasma Sintering
Table 1
Specification of materials used.
| | Material | Density
(g/cm3) | Average size | Purity, % |
| | SiC | 3.216 | 800 nm | >99 | | TaC | 13.9 | 1000 nm | >99 | | MWCNTs | 2.1 | Do < 20 nm, Di: 4 nm, : 1–12 um | >99 wt | | B4C | 2.51 | 45–55 nm | >99 |
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