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Advances in Materials Science and Engineering
Volume 2015, Article ID 639028, 16 pages
http://dx.doi.org/10.1155/2015/639028
Review Article

Properties and Microstructures of Sn-Ag-Cu-X Lead-Free Solder Joints in Electronic Packaging

School of Mechanical and Electrical Engineering, Jiangsu Normal University, Xuzhou 221116, China

Received 6 October 2014; Accepted 23 November 2014

Academic Editor: Hossein Moayedi

Copyright © 2015 Lei Sun and Liang Zhang. This is an open access article distributed under the Creative Commons Attribution License, which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.

How to Cite this Article

Lei Sun and Liang Zhang, “Properties and Microstructures of Sn-Ag-Cu-X Lead-Free Solder Joints in Electronic Packaging,” Advances in Materials Science and Engineering, vol. 2015, Article ID 639028, 16 pages, 2015. https://doi.org/10.1155/2015/639028.