Properties and Microstructures of Sn-Ag-Cu-X Lead-Free Solder Joints in Electronic Packaging

Figure 11

SEM micrographs of ((a) and (b)) SnAgCu and ((c) and (d)) SnAgCu-1TiO₂ solder joints on Ag metallized Cu pads after ((a) and (c)) 8 and ((b) and (d)) 16 reflow cycles [21].

(a)

(b)

(c)

(d)