Properties and Microstructures of Sn-Ag-Cu-X Lead-Free Solder Joints in Electronic Packaging

<div>The microstructure of SnAgCu solder [<a href="/journals/amse/2015/639028/#B69">69</a>].</div>

Advances in Materials Science and Engineering

Figure 6: Properties and Microstructures of Sn-Ag-Cu-X Lead-Free Solder Joints in Electronic Packaging 