Properties and Microstructures of Sn-Ag-Cu-X Lead-Free Solder Joints in Electronic Packaging

Table 1

Tensile strength of Sn3.5Ag0.7Cu-xSb [55].

Ageing time (h)	SAC	SAC-0.8Sb	SAC-2.0Sb
	UTS (MPa)	UTS (MPa)	UTS (MPa)
0	46.63	52.38	44.55
200	39.73	47.62	45.97
400	34.82	43.71	39.80
600	33.09	45.29	36.05