Table of Contents Author Guidelines Submit a Manuscript
Advances in Materials Science and Engineering
Volume 2015, Article ID 847191, 7 pages
http://dx.doi.org/10.1155/2015/847191
Research Article

A Study of Thin Film Resistors Prepared Using Ni-Cr-Si-Al-Ta High Entropy Alloy

1Department of Mechanical Engineering, National Pingtung University of Science & Technology, Pingtung 91201, Taiwan
2Department of Electrical Engineering, National Cheng Kung University, Tainan 701, Taiwan
3Department of Materials Engineering, National Pingtung University of Science & Technology, Pingtung 91201, Taiwan

Received 23 October 2014; Revised 29 November 2014; Accepted 28 December 2014

Academic Editor: Ke Fu Yao

Copyright © 2015 Ruei-Cheng Lin et al. This is an open access article distributed under the Creative Commons Attribution License, which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.

Linked References

  1. B.-J. Lee, D.-C. Lee, and C.-S. Kim, “Electrical properties of sputtered Ni-Cr-Al-Cu thin film resistors with Ni and Cr contents,” Journal of the Korean Physical Society, vol. 40, no. 2, pp. 339–343, 2002. View at Google Scholar · View at Scopus
  2. A. P. Bhatt, C. A. Luck, and D. M. Stevenson, in Proceedings of the International Symposium on Microelectronics, p. 370, 1984.
  3. K. Matsuda, K. Sato, T. Doi, K. Ogata, and K. Konishi, “Super precision metal film resistors,” National Technical Report, vol. 26, pp. 283–288, 1980. View at Google Scholar · View at Scopus
  4. W. E. Isler and L. A. Kitchman, “Influence of deposition and processing parameters on the tcr of ni-cr-cu-al alloy film resistors,” IEEE Transactions on Parts, Materials and Packaging, vol. 5, no. 3, pp. 139–146, 1969. View at Publisher · View at Google Scholar · View at Scopus
  5. E. Schippel, “Modifications test of vacuum deposition Ni/Cr films with Mn and Si for thin film resistors,” Kristall und Technik, vol. 15, no. 8, pp. 917–919, 1980. View at Publisher · View at Google Scholar
  6. X. Y. Wang, Z. S. Zhang, and T. Bai, “Investigation on powder metallurgy Cr–Si–Ta–Al alloy target for high-resistance thin film resistors with low temperature coefficient of resistance,” Materials and Design, vol. 31, no. 3, pp. 1302–1307, 2010. View at Publisher · View at Google Scholar · View at Scopus
  7. J. W. Yeh, S. K. Chen, S. J. Lin et al., “Nanostructured high-entropy alloys with multiple principal elements: novel alloy design concepts and outcomes,” Advanced Engineering Materials, vol. 6, no. 5, pp. 299–274, 2004. View at Publisher · View at Google Scholar · View at Scopus
  8. J.-W. Yeh, S.-K. Chen, J.-Y. Gan et al., “Formation of simple crystal structures in Cu-Co-Ni-Cr-Al-Fe-Ti-V alloys with multiprincipal metallic elements,” Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science, vol. 35, no. 8, pp. 2533–2536, 2004. View at Publisher · View at Google Scholar · View at Scopus
  9. C. Y. Hsu, J. W. Yeh, S. K. Chen, and T. T. Shun, “Wear resistance and high-temperature compression strength of Fcc CuCoNiCrAl0.5Fe alloy with boron addition,” Metallurgical and Materials Transactions A, vol. 35, no. 5, pp. 1465–1469, 2004. View at Publisher · View at Google Scholar
  10. O. N. Senkov, G. B. Wilks, J. M. Scott, and D. B. Miracle, “Mechanical properties of Nb25Mo25Ta25W25 and V20Nb20Mo20Ta20W20 refractory high entropy alloys,” Intermetallics, vol. 19, no. 5, pp. 698–706, 2011. View at Publisher · View at Google Scholar · View at Scopus
  11. O. N. Senkov, S. V. Senkova, D. B. Miracle, and C. Woodward, “Mechanical properties of low-density, refractory multi-principal element alloys of the Cr-Nb-Ti-V-Zr system,” Materials Science and Engineering A, vol. 565, pp. 51–62, 2013. View at Publisher · View at Google Scholar · View at Scopus
  12. F. Otto, A. Dlouhý, C. Somsen, H. Bei, G. Eggeler, and E. P. George, “The influences of temperature and microstructure on the tensile properties of a CoCrFeMnNi high-entropy alloy,” Acta Materialia, vol. 61, no. 15, pp. 5743–5755, 2013. View at Publisher · View at Google Scholar · View at Scopus
  13. D. S. Campbell and B. Hendry, “The effect of composition on the temperature coefficient of resistance of NiCr films,” The British Journal of Applied Physics, vol. 16, no. 11, pp. 1719–1722, 1965. View at Publisher · View at Google Scholar
  14. J. G. Swanson, D. S. Campbell, and J. C. Anderson, “A study of electrical conduction in island structure nickel and 80:20 nickel-chromium films,” Thin Solid Films, vol. 1, no. 5, pp. 325–342, 1968. View at Publisher · View at Google Scholar · View at Scopus
  15. L. Lassak and K. Hieber, “Structural and electrical properties of evaporated Cr-Ni films as a function of gas pressure,” Thin Solid Films, vol. 17, no. 1, pp. 105–111, 1973. View at Publisher · View at Google Scholar · View at Scopus
  16. G. Nocerino and K. E. Singer, “The electrical and compositional structure of thin Ni-Cr films,” Thin Solid Films, vol. 57, no. 2, pp. 343–348, 1979. View at Publisher · View at Google Scholar · View at Scopus
  17. M. I. Bîrjega, C. A. Constantin, I. T. Florescu, and C. Sârbu, “Crystallization of amorphous sputtered 55%Cr–45%Ni thin films,” Thin Solid Films, vol. 92, no. 4, pp. 315–322, 1982. View at Publisher · View at Google Scholar · View at Scopus
  18. S. Schiller, U. Heisig, K. Goedicke et al., “Plasmatron sputtering for the production of high stability NiCr resistive films,” Thin Solid Films, vol. 119, no. 2, pp. 211–216, 1984. View at Publisher · View at Google Scholar · View at Scopus
  19. D.-J. Feng, Y.-C. Lee, and Y.-B. Chen, “A Study of Ni-Cr-Si-based thin film resistors prepared by DC magnetron sputtering,” International Journal of Materials Engineering and Technology, vol. 11, no. 2, pp. 149–164, 2014. View at Google Scholar
  20. S. Taioli, C. Cazorla, M. J. Gillan, and D. Alfè, “Melting curve of tantalum from first principles,” Physical Review B, vol. 75, no. 21, Article ID 214103, 2007. View at Publisher · View at Google Scholar · View at Scopus
  21. C. Ng, S. Guo, J. Luan, S. Shi, and C. T. Liu, “Entropy-driven phase stability and slow diffusion kinetics in an Al0.5CoCrCuFeNi high entropy alloy,” Intermetallics, vol. 31, pp. 165–172, 2012. View at Publisher · View at Google Scholar · View at Scopus
  22. M.-H. Tsai and J.-W. Yeh, “High-entropy alloys: a critical review,” Materials Research Letters, vol. 2, no. 3, pp. 107–123, 2014. View at Publisher · View at Google Scholar
  23. A. Anders, J. Andersson, and A. Ehiasarian, “High power impulse magnetron sputtering: current-voltage-time characteristics indicate the onset of sustained self-sputtering,” Journal of Applied Physics, vol. 102, no. 11, Article ID 113303, 11 pages, 2007. View at Publisher · View at Google Scholar
  24. D.-J. Kwak, M.-W. Park, and Y.-M. Sung, “Discharge power dependence of structural and electrical properties of Al-doped ZnO conducting film by magnetron sputtering (for PDP),” Vacuum, vol. 83, no. 1, pp. 113–118, 2008. View at Publisher · View at Google Scholar · View at Scopus
  25. N. Witit-Anun, J. Kaewkhao, and S. Chaiyakun, “Effect of sputtering power on structural and optical properties of ALN thin film deposited by reactive DC sputtering technique,” Advanced Materials Research, vol. 770, pp. 177–180, 2013. View at Publisher · View at Google Scholar · View at Scopus
  26. A. Chaoumead, Y.-M. Sung, and D.-J. Kwak, “The effects of RF sputtering power and gas pressure on structural and electrical properties of ITiO thin film,” Advances in Condensed Matter Physics, vol. 2012, Article ID 651587, 7 pages, 2012. View at Publisher · View at Google Scholar · View at Scopus
  27. M.-C. Jun and J.-H. Koh, “Effects of annealing temperature on properties of Al-doped ZnO thin films prepared by sol-gel dip-coating,” Journal of Electrical Engineering and Technology, vol. 8, no. 1, pp. 163–167, 2013. View at Publisher · View at Google Scholar · View at Scopus
  28. Z. Z. Zhi, Y. C. Liu, B. S. Li et al., “Effects of thermal annealing on ZnO films grown by plasma enhanced chemical vapour deposition from Zn(C2H5)2 and CO2 gas mixtures,” Journal of Physics D: Applied Physics, vol. 36, no. 6, pp. 719–722, 2003. View at Publisher · View at Google Scholar · View at Scopus
  29. X. Dong, J. Wu, and L. Mao, “The crystallization of Cr-Si-Ni-Al amorphous films-nucleation and growth of intermetallic phase Cr(Al,Si)2,” Intermetallics, vol. 11, no. 8, pp. 779–785, 2003. View at Publisher · View at Google Scholar · View at Scopus
  30. J. Roelke, “Nichrome thin film technology and its application,” Electrocomponent Science and Technology, vol. 9, no. 1, pp. 51–57, 1980. View at Google Scholar · View at Scopus
  31. S. Vinayak, H. P. Vyas, and V. D. Vankar, “Microstructure and electrical characteristics of Ni-Cr thin films,” Thin Solid Films, vol. 515, no. 18, pp. 7109–7116, 2007. View at Publisher · View at Google Scholar · View at Scopus