Research Article

Effect of HPPMS Pulse-Frequency on Plasma Discharge and Deposited AlTiN Coating Properties

Table 1

Process parameters for heating, cleaning, and deposition of the (Al,Ti)N coatings in the present study.

ProcessTimeParameterValue and unit

(1) Heating and evacuation90 minHeating power
starting pressure
10 kW
8.0 mPa

(2) Substrate cleaning30 minIon etching power9 kW

(3) Deposition of (Al,Ti)N30 min (per various frequency)Frequency
Duty cycle
Period duration
Pulse length
Mean dc cathode Power
Sputtering gas Pressure
Ar partial Pressure
Kr partial Pressure
N2 partial Pressure
Temperature
dc bias voltage
100/200/300/400/500 [Hz]
0.5/1.0/1.5/2.0/2.5 [%]
10.0/5.0/3.3/2.5/2.0 [ms]
50 μs (const.)
4 kW (const.)
0.6 Pa (const.)
414 mPa
103 mPa
83 mPa
500°C (const.)
−100 V (const.)