Research Article

Effect of Indium Additions on the Formation of Interfacial Intermetallic Phases and the Wettability at Sn-Zn-In/Cu Interfaces

Figure 5

Thickness of intermetallic layers (Cu5Zn8, CuZn4) at /Cu and + 1.5% In/Cu interface at 250°C.
(a)
(b)