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Advances in Materials Science and Engineering
Volume 2018, Article ID 1954573, 8 pages
https://doi.org/10.1155/2018/1954573
Research Article

Real-Time and Quantitative Measurement of Crack-Tip Stress Intensity Factors Using Digital Holographic Interferometry

1Faculty of Civil Engineering and Mechanics, Kunming University of Science and Technology, Kunming, Yunnan 650500, China
2Key Laboratory of Yunnan Province for Disaster Reduction in Civil Engineering, Kunming University of Science and Technology, Kunming, Yunnan 650500, China

Correspondence should be addressed to Rongxin Guo; nc.ude.tsumk@xroug

Received 8 December 2017; Accepted 22 March 2018; Published 16 May 2018

Academic Editor: Hiroshi Noguchi

Copyright © 2018 Haiting Xia et al. This is an open access article distributed under the Creative Commons Attribution License, which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.

How to Cite this Article

Haiting Xia, Rongxin Guo, Feng Yan, and Heming Cheng, “Real-Time and Quantitative Measurement of Crack-Tip Stress Intensity Factors Using Digital Holographic Interferometry,” Advances in Materials Science and Engineering, vol. 2018, Article ID 1954573, 8 pages, 2018. https://doi.org/10.1155/2018/1954573.