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Advances in Materials Science and Engineering
Volume 2018, Article ID 4263497, 5 pages
https://doi.org/10.1155/2018/4263497
Research Article

Microstructure and Thermal Conductivity of Sintered Reaction-Bonded Silicon Nitride: The Particle Size Effects of MgO Additive

1Material Science and Engineering, Pusan National University, Busandaehak-ro 63 Beon-gil, Geumjeong-gu, Busan 46241, Republic of Korea
2Engineering Ceramics Research Group, Korea Institute of Materials Science, 797 Changwondaero, Sungsanku, Changwon, Gyeongnam 51508, Republic of Korea

Correspondence should be addressed to Young-Jo Park; rk.er.smik@78krapjy

Received 8 May 2018; Revised 18 July 2018; Accepted 5 August 2018; Published 5 September 2018

Academic Editor: Fernando Rubio-Marcos

Copyright © 2018 Shin-Il Go et al. This is an open access article distributed under the Creative Commons Attribution License, which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.

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