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Advances in Materials Science and Engineering
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Advances in Materials Science and Engineering
/
2018
/
Article
/
Tab 3
/
Research Article
Microstructure and Thermal Conductivity of Sintered Reaction-Bonded Silicon Nitride: The Particle Size Effects of MgO Additive
Table 3
Thermal diffusivity, density, and thermal conductivity for specimens.
Specimen
Thermal diffusivity (cm
2
·s
−1
)
Density (g·cm
−3
)
Thermal conductivity [
5
] (W·m
−1
·K
−1
)
Ac
40.1
3.2
87.8
Af
35.5
3.2
77.3