Effect of Power Cycling and Heat Aging on Reliability and IMC Growth of Sn-5Sb and Sn-10Sb Solder Joints

<div>Shape and dimensions of the specimen for the power cycling test and heat aging test.</div>

Advances in Materials Science and Engineering

Figure 1: Effect of Power Cycling and Heat Aging on Reliability and IMC Growth of Sn-5Sb and Sn-10Sb Solder Joints 