Effect of Power Cycling and Heat Aging on Reliability and IMC Growth of Sn-5Sb and Sn-10Sb Solder Joints

<div>Thickness of IMC layers versus square root of heat aging time at 200°C.</div>

Advances in Materials Science and Engineering

Figure 13: Effect of Power Cycling and Heat Aging on Reliability and IMC Growth of Sn-5Sb and Sn-10Sb Solder Joints 