Research Article
Effect of Multiwalled Carbon Nanotubes and Electroless Copper Plating on the Tensile Behavior of Carbon Fiber Reinforced Polymers
Table 1
Chemical compounds of electroless copper plating.
| | Process | Chemical compounds | Amount |
| | Activation of carbon fiber fabrics | HNO3 (65–68%) | 200 mL/L | | SnCl2 (90%) | 50 g/L | | HCl (35–36%) | 80 mL/L | | AgNO3 (99%) | 20 g/L |
| | Copper plating bath | CuSO4·5H2O (99%) | 22 g/L | | C6H5Na3O7·2H2O (99%) | 56 g/L | | NaOH (93%) | 0.6 g/L | | N2H4·H2O (98%) | 44 mL/L |
| | Cleaning | C3H6O (99.7%) | 500 mL/L |
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