Finite Element Analysis of Temperature Distribution and Stress Behavior of Squeeze Pressure Composites

<table class="table-group" id="tab3"><tr><td><table class="table"><tr><td class="thead-hr" colspan="4"><hr/></td></tr><tr class="thead"><td class="align_left">Material</td><td class="align_center">Thermal conductivity (W/m°C)</td><td class="align_center">Density (kg/m<sup>3</sup>)</td><td class="align_center">Specific heat (J/kg·k)</td></tr><tr><td class="thead-hr" colspan="4"><hr/></td></tr><tr><td class="align_left">Silicon carbide</td><td class="align_center">100</td><td class="align_center">3200</td><td class="align_center">1300</td></tr><tr class="table-tr"><td colspan="4"><hr class="tbody-hr"/></td></tr></table></td></tr></table>

<div>Properties of SiC [<a href="/journals/amse/2021/8665674/#B9" target="_blank">9</a>].</div>

Advances in Materials Science and Engineering

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Table 3

Table 3: Finite Element Analysis of Temperature Distribution and Stress Behavior of Squeeze Pressure Composites 