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ElectroComponent Science and Technology
Volume 3, Issue 1, Pages 21-42
http://dx.doi.org/10.1155/APEC.3.21

Adhesion Measurement of Thin Films

MHV System Products Assurance, IBM Corporation, Poughkeepsie 12602, N.Y., USA

Received 18 August 1975

Copyright © 1976 Hindawi Publishing Corporation. This is an open access article distributed under the Creative Commons Attribution License, which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.

How to Cite this Article

K. L. Mittal, “Adhesion Measurement of Thin Films,” ElectroComponent Science and Technology, vol. 3, no. 1, pp. 21-42, 1976. https://doi.org/10.1155/APEC.3.21.