Table of Contents Author Guidelines Submit a Manuscript
ElectroComponent Science and Technology
Volume 4, Issue 3-4, Pages 219-223

Economics of Thick and Thin Film Hybrid Production in Europe

1Film Circuit Product Group, ITT Components Group Europe, Devon, Paignton, UK
2Department of Electronic and Electrical Engineering, University of Technology, Loughborough LE11 3TU, UK

Received 28 June 1977

Copyright © 1977 Hindawi Publishing Corporation. This is an open access article distributed under the Creative Commons Attribution License, which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.


This paper is a report of a discussion panel held at the First European Conference on Hybrid Microelectronics, concerning the Economics of Hybrid Production. Figures were presented at the discussion showing the sizes of the markets in the U.S.A. and in Europe, demonstrating the percentage of total hybrid markets associated with thin film technology and also the percentage of the market associated with hermetically packaged circuits. It was shown that the growth rate in hybrid technology is similar to that predicted for integrated circuits, a result which can be explained in terms of the interconnection facility which hybrid technology offers.