Active and Passive Electronic Components

The First European Hybrid Microelectronics Conference. Part II


Status
Published

The First European Hybrid Microelectronics Conference. Part II

Articles

  • Special Issue
  • - Volume 4
  • - Article ID 286256

Economics of Thick and Thin Film Hybrid Production in Europe

D. Boswell | D. S. Campbell
  • Special Issue
  • - Volume 4
  • - Article ID 689526

Characterization of Thick Film Capicitors

Y. Leroy | M. Descamps | M. Vernet
  • Special Issue
  • - Volume 4
  • - Article ID 129897

Influence of the Metal Migration From Screen-and-Fired Terminations on the Electrical Characteristics of Thick-Film Resistors

A. Cattaneo | M. Cocito | ... | M. Prudenziati
  • Special Issue
  • - Volume 4
  • - Article ID 763989

Erratum

  • Special Issue
  • - Volume 4
  • - Article ID 134203

CALHYM: A Computer Program for the Automatic Layout of Large Digital Hybrid Microcircuits

H. Beke | S. Mazur | ... | R. Van Overstraeten
  • Special Issue
  • - Volume 4
  • - Article ID 359138

Comparison of Arc Erosive and Laser Beam Trimming of Thin Film Resistors

Zs. Illyefalvi-Vitéz
  • Special Issue
  • - Volume 4
  • - Article ID 635181

Announcements

  • Special Issue
  • - Volume 4
  • - Article ID 163892

Thin Film Integrated RC-Networks With Compensated Temperature Coefficients of R and C

H. W. Pötzlberger
  • Special Issue
  • - Volume 4
  • - Article ID 234691

Reactive Sputtering of NiCr Resistors With Closely Adjustable Temperature Coefficient of Resistance

Jürgen Griessing
  • Special Issue
  • - Volume 4
  • - Article ID 381989

Optimisation of Thin and Thick Film Technology for Hybrid Microwave Circuits

Holger Meinel | Bernhard Rembold | Werner Wiesbeck
Active and Passive Electronic Components
 Journal metrics
Acceptance rate14%
Submission to final decision54 days
Acceptance to publication35 days
CiteScore1.100
Impact Factor-
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