Active and Passive Electronic Components

The First European Hybrid Microelectronics Conference. Part II


Status
Published

The First European Hybrid Microelectronics Conference. Part II

Articles

  • Special Issue
  • - Volume 4
  • - Article ID 723768

A High Speed ECL Multiplexer in Beam Lead, Hybrid Technology

J. B. Coughlin | J. B. Hughes | ... | F. W. Siegert
  • Special Issue
  • - Volume 4
  • - Article ID 681690

A New Concept in Calculation of Thick Film Resistors

G. Stecher
  • Special Issue
  • - Volume 4
  • - Article ID 534626

Adhesion Measurements of Metallizations for Hybrid Microcircuits

H. G. Kadereit | A. Schlemm
  • Special Issue
  • - Volume 4
  • - Article ID 754930

Remarks on Wire and Die Bonding for Hybrid Circuits

A. Soffa
  • Special Issue
  • - Volume 4
  • - Article ID 129897

Influence of the Metal Migration From Screen-and-Fired Terminations on the Electrical Characteristics of Thick-Film Resistors

A. Cattaneo | M. Cocito | ... | M. Prudenziati
  • Special Issue
  • - Volume 4
  • - Article ID 879204

The Reliability, Testing and Evaluation of Hybrid Microcircuits

A. H. George
  • Special Issue
  • - Volume 4
  • - Article ID 359138

Comparison of Arc Erosive and Laser Beam Trimming of Thin Film Resistors

Zs. Illyefalvi-Vitéz
  • Special Issue
  • - Volume 4
  • - Article ID 234691

Reactive Sputtering of NiCr Resistors With Closely Adjustable Temperature Coefficient of Resistance

Jürgen Griessing
  • Special Issue
  • - Volume 4
  • - Article ID 689526

Characterization of Thick Film Capicitors

Y. Leroy | M. Descamps | M. Vernet
  • Special Issue
  • - Volume 4
  • - Article ID 286256

Economics of Thick and Thin Film Hybrid Production in Europe

D. Boswell | D. S. Campbell
Active and Passive Electronic Components
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Article of the Year Award: Outstanding research contributions of 2021, as selected by our Chief Editors. Read the winning articles.