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H. G. Kadereit, A. Schlemm, "Adhesion Measurements of Metallizations for Hybrid Microcircuits", Active and Passive Electronic Components, vol. 4, Article ID 534626, 4 pages, 1977. https://doi.org/10.1155/APEC.4.147
Adhesion Measurements of Metallizations for Hybrid Microcircuits
In a method developed for measuring the adhesion of metallic films for hybrid microelectronic circuits, pull rods soldered or epoxy bonded to metallization pads are pulled off at an angle normal to the substrate. The test circuits and testing devices are described. Tensile strengths of 40 to 80 N/mm2 and 5 to 30 N/mm2 are typical for thin-film circuits and thick-film circuits, respectively. The weakest point in the overall circuit configuration is determined. The information obtained indicates the maximum permissible mechanical loads to which the discrete devices of microelectronic circuits can be exposed and may also be evaluated for process optimization.
Copyright © 1977 Hindawi Publishing Corporation. This is an open access article distributed under the Creative Commons Attribution License, which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.